Applications of AI and Iot in Geotechnical Engineering for Sustainable Infrastructure, (Hardcover)

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Management number 238811584 Release Date 2026/07/11 List Price US$64.00 Model Number 238811584
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<p>Artificial intelligence (AI) and the Internet of Things (IoT) are transforming the way geotechnical engineers monitor, analyze, and manage soil-structure systems. <i>Applications of AI and IoT in Geotechnical Engineering for Sustainable Infrastructure </i>explores how these emerging digital technologies can enhance decision-making, improve infrastructure resilience, and support sustainable development in civil engineering projects. It examines the integration of AI and IoT in geotechnical engineering, including slope stability assessments, data-driven techniques for soil classification and characterization, foundation and liquefaction analysis, optimizing earthwork practices and operations, tunnels, and earth-retaining structures using real-time sensor networks and data-driven models. This book also discusses machine learning techniques for predicting soil behavior, real-time monitoring of pile foundations, automated site investigation methods, and digital tools for risk assessment and infrastructure health monitoring/assessment.</p><p>This book is intended for researchers, graduate students, and practicing engineers in geotechnical and civil engineering. It will also benefit professionals working in smart infrastructure, disaster risk reduction, and infrastructure asset management who are interested in integrating digital technologies into sustainable engineering practice.</p>

  • Applications of AI and Iot in Geotechnical Engineering for Sustainable Infrastructure, (Hardcover)
  • Author: Vedprakash C Maralapalle
  • ISBN: 9781041199175
  • Format: Hardcover
  • Publication Date: 2026-10-05
  • Page Count: 356
Book format Hardcover
Fiction/nonfiction Non-Fiction
Genre Computing & Internet
Publication date October, 2026
Pages 356
Subgenre Construction
Series title No Series
Number in series 0
Edition 1
Publisher CRC Press
Language English
Edu focus Engineering
Educational level College
Is collectible N
Binding type Case Binding
Recording time 0 min
Retail packaging Single Piece
Assembled product dimensions (l x w x h) 6.13 x 6.00 x 9.19 in
Assembled product weight 1.25 lb
Bisac subject heading Technology & Engineering

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